Flexible display device and method of manufacturing the same

ABSTRACT

A flexible display device includes: a flexible substrate; a photo-curable adhesive layer disposed on the flexible substrate; and a metal wiring disposed on the photo-curable adhesive layer. The metal wiring defines a plurality of holes. The flexible display device and a method of manufacturing the flexible display device may substantially prevent detachment of the metal wiring formed on the flexible substrate.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional application of U.S. patent applicationSer. No. 15/979,747 filed May 15, 2018, which claims priority under 35U.S.C. § 119 to Korean Patent Application No. 10-2017-0060264, filed onMay 16, 2017, in the Korean Intellectual Property Office (KIPO), thedisclosures of which are incorporated by reference herein in theirentirety.

TECHNICAL FIELD

Embodiments of the present disclosure relate to a flexible displaydevice and to a method of manufacturing the flexible display device.

DISCUSSION OF RELATED ART

Display devices display images using light emitting elements. In recenttimes, flat panel display (“FPD”) devices have been widely used asdisplay devices. The FPD display devices may be classified into liquidcrystal display (“LCD”) devices, organic light emitting diode (“OLED”)display devices, plasma display panel (“PDP”) devices, electrophoreticdisplay devices, and the like based on a light emitting scheme thereof.

Flexible display panels that can be bent have been developed recently.Such a flexible display panel may be used in various fields because itmay be used in a folded or curved form. Since organic light emittingelements may be manufactured in a stack structure of a thin film type,they have excellent flexibility and are thus attracting attention asdisplay elements of the flexible display panel.

However, when a stress is concentrated on a metal thin film formed on aflexible substrate, cracks may be generated and a metal thin film may bedetached off from the flexible substrate.

It is to be understood that this background is intended to provideuseful background for understanding the subject matter of the presentdisclosure, and as such disclosed herein, the background may includeideas, concepts, or recognitions that are not a part of what is known orappreciated by those skilled in the pertinent art prior to acorresponding effective filing date of the present disclosure.

SUMMARY

Embodiments of the present disclosure may be directed to a flexibledisplay device and a method of manufacturing the flexible display devicethat may substantially prevent detachment of a metal thin film formed ona flexible substrate.

According to an exemplary embodiment, a flexible display deviceincludes: a flexible substrate; a photo-curable adhesive layer disposedon the flexible substrate; and a metal wiring disposed on thephoto-curable adhesive layer. The metal wiring defines a plurality ofholes.

Each of the plurality of holes may have an area in a range from about0.1 μm² to about 0.2 μm² on a plane.

Each of the plurality of holes may have at least one of a circular shapeand a polygonal shape.

The plurality of holes may include a first hole, a second hole, and athird hole that are adjacent to each other, and a first imaginarystraight line passing through a center of the first hole and a center ofthe second hole and a second imaginary straight line passing through thecenter of the first hole and a center of the third hole maysubstantially form a right angle.

The plurality of holes may include a first hole, a second hole, and athird hole that are adjacent to each other, and a first imaginarystraight line passing through a center of the first hole and a center ofthe second hole and a second imaginary straight line passing through thecenter of the first hole and a center of the third hole maysubstantially form 60 degrees.

The holes may be spaced apart from each other at a substantially equalspatial interval.

The holes may be spaced apart from each other by a spatial interval ofabout 300 nm or more.

The metal wiring may be in the form of a matrix.

The metal wiring may include at least one of aluminum (Al), silver (Ag),copper (Cu), gold (Au), platinum (Pt), iron (Fe), nickel (Ni), and/ortitanium (Ti).

According to an exemplary embodiment, a method of manufacturing aflexible display device includes: depositing a metal thin film on a moldsubstrate defined with a plurality of grooves; forming a photo-curableadhesive layer on a flexible substrate; transferring the metal thin filmon the photo-curable adhesive layer to form a metal wiring that definesa plurality of holes corresponding to the plurality of grooves; andcuring the photo-curable adhesive layer.

Each of the plurality of grooves and the plurality of holes may have anarea in a range from about 0.1 μm² to about 0.2 μm² on a plane.

Each of the plurality of grooves and the plurality of holes may have atleast one of a circular shape and a polygonal shape on a plane.

The plurality of holes may include a first hole, a second hole, and athird hole that are adjacent to each other, and a first imaginarystraight line passing through a center of the first hole and a center ofthe second hole and a second imaginary straight line passing through thecenter of the first hole and a center of the third hole maysubstantially form a right angle.

The plurality of holes may include a first hole, a second hole, and athird hole that are adjacent to each other, and a first imaginarystraight line passing through a center of the first hole and a center ofthe second hole and a second imaginary straight line passing through thecenter of the first hole and a center of the third hole maysubstantially form 60 degrees.

The grooves and the holes may be spaced apart from each other at asubstantially equal spatial interval.

The grooves and the holes may be spaced apart from each other by aspatial interval of about 300 nm or more.

The metal wiring may be in the form of a matrix.

The method may further include pre-curing the photo-curable adhesivelayer before transferring the metal thin film on the photo-curableadhesive layer to form the metal wiring that defines the plurality ofholes.

The metal wiring may include at least one of Al, Ag, Cu, Au, Pt, Fe, Ni,and/or Ti.

The foregoing is illustrative only, and is not intended to be in any waylimiting. In addition to the illustrative aspects, exemplaryembodiments, and features described above, further aspects, exemplaryembodiments, and features will become apparent to those of ordinaryskill in the art by reference to the drawings, and the followingdetailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the present disclosure will become moreapparent by describing in detail exemplary embodiments thereof withreference to the accompanying drawings, wherein:

FIG. 1 is a cross-sectional view illustrating a flexible display deviceaccording to an exemplary embodiment;

FIGS. 2A, 2B, and 2C are plan views illustrating metal wirings accordingto first, second, and third exemplary embodiments;

FIGS. 3A, 3B, and 3C are plan views illustrating metal wirings accordingto fourth, fifth, and sixth exemplary embodiments;

FIG. 4 is a flowchart illustrating a process of manufacturing a flexibledisplay device according to a first exemplary embodiment;

FIGS. 5A, 5B, 5C, and 5D are views illustrating a process ofmanufacturing the flexible display device according to the firstexemplary embodiment;

FIG. 6A is a plan view illustrating a part A of FIG. 5D;

FIG. 6B is a plan view illustrating a part B of FIG. 5D;

FIGS. 7A and 7B are views illustrating mechanical characteristics of ametal wiring according to an exemplary embodiment;

FIG. 8 is a plan view illustrating a flexible display device accordingto an exemplary embodiment; and

FIG. 9 is a cross-sectional view taken along the line I-I′ of FIG. 8.

DETAILED DESCRIPTION

Exemplary embodiments will now be described more fully hereinafter withreference to the accompanying drawings. Although the present disclosuremay be modified in various manners and have several exemplaryembodiments, the exemplary embodiments are illustrated in theaccompanying drawings and will be mainly described in the presentdisclosure. However, the scope of the present disclosure is not limitedto the exemplary embodiments and should be construed as includingchanges, equivalents, and substitutions without deviating from thespirit and scope of the present disclosure.

In the drawings, thicknesses of layers and areas are illustrated in anenlarged manner for clarity and ease of description thereof. When alayer, area, or plate is referred to as being “on” another layer, area,or plate, it may be directly on the other layer, area, or plate, or oneor more intervening layers, areas, or plates may be presenttherebetween. Conversely, when a layer, area, or plate is referred to asbeing “directly on” another layer, area, or plate, intervening layers,areas, or plates may be absent therebetween. Further when a layer, area,or plate is referred to as being “below” another layer, area, or plate,it may be directly below the other layer, area, or plate, or one or moreintervening layers, areas, or plates may be present therebetween.Conversely, when a layer, area, or plate is referred to as being“directly below” another layer, area, or plate, intervening layers,areas, or plates may be absent therebetween.

The spatially relative terms “below”, “beneath”, “lower”, “above”,“upper,” and the like, may be used herein for ease of description todescribe the spatial relations between one element or component andanother element or component as illustrated in the drawings. It will beunderstood that the spatially relative terms are intended to encompassdifferent orientations of the device in use or operation, in addition tothe orientation depicted in the drawings. For example, in the case wherea device illustrated in the drawing is turned over, the device located“below” or “beneath” another device may be placed “above” or “on”another device. Accordingly, the illustrative term “below” or “beneath”may include both the lower and upper positions. The device may also beoriented in the other direction, and the spatially relative terms may beinterpreted differently depending on the orientations.

Throughout the present disclosure, when an element is referred to asbeing “connected” to another element, the element is “directlyconnected” to the other element, or “electrically connected” to theother element with one or more intervening elements interposedtherebetween. It will be further understood that the terms “comprises,”“including,” “includes,” and/or “including,” when used in the presentdisclosure, specify the presence of stated features, integers, steps,operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

It will be understood that, although the terms “first,” “second,”“third,” and the like may be used herein to describe various elements,these elements should not be limited by these terms. These terms areonly used to distinguish one element from another element. Thus, “afirst element” discussed below could be termed “a second element” or “athird element,” and “a second element” and “a third element” may betermed likewise without departing from the teachings herein.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for a particularvalue or a range or values as determined by one of ordinary skill in theart, considering the measurement in question and the error associatedwith measurement of the particular value(s) (i.e., the limitations ofthe measurement system). For example, “about” may mean within one ormore standard deviations, or within ±30%, 20%, 10%, 5% of the statedvalue(s).

Unless otherwise defined, terms used herein (including technical andscientific terms) have the same meaning as commonly understood by thoseskilled in the art to which the present disclosure pertains. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an ideal or excessively formal sense unlessclearly defined in the present disclosure.

Some of the parts that are not associated with the description may notbe provided to specifically describe embodiments of the presentdisclosure, and like reference numerals refer to like elementsthroughout the present disclosure.

Hereinafter, an exemplary embodiment will be described in detail withreference to FIGS. 1 to 9.

FIG. 1 is a cross-sectional view illustrating a flexible display deviceaccording to an exemplary embodiment.

Referring to FIG. 1, a flexible display device includes a flexiblesubstrate 110, a photo-curable adhesive layer 310, and a metal wiring320.

The flexible substrate 110 may include a flexible material. The flexiblematerial may include a plastic material. For example, the flexiblesubstrate 110 may include one selected from a group consisting of:kapton, polyethersulphone (PES), polycarbonate (PC), polyimide (PI),polyethyleneterephthalate (PET), polyethylene naphthalate (PEN),polyacrylate (PAR), fiber reinforced plastic (FRP), and/or the like.

The flexible substrate 110 may have a thickness in a range from about 5μm to about 200 μm. When the flexible substrate 110 has a thickness lessthan about 5 μm, it is difficult for the flexible substrate 110 tostably support an organic light emitting element thereon. On the otherhand, when the flexible substrate 110 has a thickness of about 200 μm ormore, the flexible characteristics of the flexible substrate 110 may bedegraded.

The photo-curable adhesive layer 310 is disposed on the flexiblesubstrate 110. For example, the photo-curable adhesive layer 310 isdisposed between the flexible substrate 110 and the metal wiring 320 tobe described below.

The photo-curable adhesive layer 310 may be a resin such as aphoto-curable resin including a monomer, an oligomer, and a small amountof photo-initiator. When the photo-initiator included in the resin isirradiated to light, e.g., ultraviolet (UV) light, photopolymerizationreaction is initiated such that the monomer and the oligomer mayinstantaneously form a polymer to be cured.

The metal wiring 320 is disposed on the photo-curable adhesive layer310. For example, the metal wiring 320 directly contacts thephoto-curable adhesive layer 310 when disposed on the photo-curableadhesive layer 310.

The metal wiring 320 may define a plurality of holes 330. The pluralityof holes 330 will be described in detail below with reference to FIGS.2A, 2B, 2C, 3A, 3B, and 3C.

The metal wiring 320 may include at least one of aluminum (Al), silver(Ag), copper (Cu), gold (Au), platinum (Pt), iron (Fe), nickel (Ni), andtitanium (Ti).

FIGS. 2A, 2B, and 2C are plan views illustrating metal wirings accordingto first, second, and third exemplary embodiments.

Referring to FIGS. 2A, 2B, and 2C, metal wirings 321, 322, and 323define a plurality of holes 331 a, 331 b, and 331 c. Each of theplurality of holes 331 a, 331 b, and 331 c may have a circular shape ona plane. Accordingly, the metal wirings according to an exemplaryembodiment may improve mechanical durability regardless of a directionof an applied stress, thereby substantially preventing detachment of themetal wirings from the flexible substrate 110.

Each of the plurality of holes 331 a, 331 b, and 331 c may have adiameter R of about 200 nm or more and about 500 nm or less on theplane. Accordingly, each of the plurality of holes 331 a, 331 b, and 331c may have an area in a range from about 0.1 μm² to about 0.2 μm² on theplane.

Referring to FIG. 2A, the plurality of holes 331 a, 331 b, and 331 cinclude a first hole 331 a, a second hole 331 b, and a third hole 331 cthat are adjacent to each other. For example, when a center of the firsthole 331 a is defined as a first center C1, a center of the second hole331 b is defined as a second center C2, and a center of the third hole331 c is defined as a third center C3, the first center C1 may be spacedequally from the second center C2 and the third center C3 (W1=W2). Insuch an exemplary embodiment, the first center C1 may be spaced apartfrom each of the second center C2 and the third center C3 by a spatialinterval of about 300 nm or more and about 700 nm or less.

When an imaginary straight line passing through the first center C1 andthe second center C2 is defined as a first straight line L1, and anotherimaginary straight line passing through the first center C1 and thethird center C3 is defined as a second straight line L2, the firststraight line L1 and the second straight line L2 may substantially forma first angle (e.g., θ1=90 degree).

Referring to FIG. 2B, the plurality of holes 331 a, 331 b, and 331 cinclude a first hole 331 a, a second hole 331 b, and a third hole 331 cthat are adjacent to each other. The first, second, and third holes 331a, 331 b, and 331 c may be spaced apart from each other at substantiallyequal spatial intervals. For example, when a center of the first hole331 a is defined as a first center C1, a center of the second hole 331 bis defined as a second center C2, and a center of the third hole 331 cis defined as a third center C3, the first center C1 may be spacedequally from the second center C2 and the third center C3 (W1=W2). Insuch an exemplary embodiment, the first, second, and third holes 331 a,331 b, and 331 c may be spaced apart from each other by a spatialinterval of about 300 nm or more and about 700 nm or less. That is, thefirst center C1 may be spaced apart from each of the second center C2and the third center C3 by a spatial interval of about 300 nm or moreand about 700 nm or less.

In addition, when an imaginary straight line passing through the firstcenter C1 and the second center C2 is defined as a first straight lineL1, and another imaginary straight line passing through the first centerC1 and the third center C3 is defined as a second straight line L2, thefirst straight line L1 and the second straight line L2 may substantiallyform a second angle (e.g., θ2=60 degree).

Referring to FIG. 2C, the plurality of holes 331 a, 331 b, and 331 cinclude a first hole 331 a, a second hole 331 b, and a third hole 331 cthat are adjacent to each other. The first, second, and third holes 331a, 331 b, and 331 c may be spaced from each other at different spatialintervals. For example, when a center of the first hole 331 a is definedas a first center C1, a center of the second hole 331 b is defined as asecond center C2, and a center of the third hole 331 c is defined as athird center C3, the first center C1 may be spaced apart from the secondcenter C2 and the third center C3 by different spatial intervals. Insuch an exemplary embodiment, the first, second, and third holes 331 a,331 b, and 331 c may be spaced apart from each other by differentspatial intervals of about 300 nm or more and about 700 nm or less. Thatis, the first center C1 may be spaced apart from the second center C2and the third center C3 by different spatial intervals, respectively, ofabout 300 nm or more and about 700 nm or less.

FIGS. 3A, 3B, and 3C are plan views illustrating metal wirings accordingto fourth, fifth, and sixth exemplary embodiments.

Referring to FIGS. 3A, 3B, and 3C, metal wirings 324, 325, and 326define a plurality of holes 332 a, 332 b, and 332 c. The plurality ofholes 332 a, 332 b, and 332 c may have a quadrangular shape on a plane.However, exemplary embodiments are not limited thereto, and theplurality of holes 332 a, 332 b, and 332 c may have a polygonal shape ona plane. Accordingly, mechanical durability of the metal wirings may beimproved in a predetermined direction depending on the shape of theplurality of holes 332 a, 332 b, and 332 c, and the detachment of themetal wiring from the flexible substrate 110 may be substantiallyprevented.

Each of the plurality of holes 332 a, 332 b, and 332 c may have adiagonal line R of about 200 nm or more and about 500 nm or less on theplane. Accordingly, the plurality of holes 332 a, 332 b, and 332 c mayhave an area in a range from about 0.1 μm² to about 0.2 μm² on theplane.

Referring to FIG. 3A, the plurality of holes 332 a, 332 b, and 332 cinclude a first hole 332 a, a second hole 332 b, and a third hole 332 cthat are adjacent to each other. The first, second, and third holes 332a, 332 b, and 332 c may be spaced apart from each other at substantiallyequal spatial intervals. For example, when a center of the first hole332 a is defined as a first center C1, a center of the second hole 332 bis defined as a second center C2, and a center of the third hole 332 cis defined as a third center C3, the first center C1 may be spacedequally from the second center C2 and the third center C3 (W1=W2). Insuch an exemplary embodiment, the first center C1 may be spaced apartfrom each of the second center C2 and the third center C3 by a spatialinterval of about 300 nm or more and about 700 nm or less.

In addition, when an imaginary straight line passing through the firstcenter C1 and the second center C2 is defined as a first straight lineL1, and another imaginary straight line passing through the first centerC1 and the third center C3 is defined as a second straight line L2, thefirst straight line L1 and the second straight line L2 may substantiallyform a first angle (e.g., θ1=90 degree).

Referring to FIG. 3B, the plurality of holes 332 a, 332 b, and 332 cinclude a first hole 332 a, a second hole 332 b, and a third hole 332 cthat are adjacent to each other. The first, second, and third holes 332a, 332 b, and 332 c may be spaced apart from each other at substantiallyequal spatial intervals. For example, when a center of the first hole332 a is defined as a first center C1, a center of the second hole 332 bis defined as a second center C2, and a center of the third hole 332 cis defined as a third center C3, the first center C1 may be spacedequally from the second center C2 and the third center C3 (W1=W2). Insuch an exemplary embodiment, the first, second, and third holes 332 a,332 b, and 332 c may be spaced apart from each other by a spatialinterval of about 300 nm or more and about 700 nm or less. That is, thefirst center C1 may be spaced apart from each of the second center C2and the third center C3 by a spatial interval of about 300 nm or moreand about 700 nm or less.

In addition, when an imaginary straight line passing through the firstcenter C1 and the second center C2 is defined as a first straight lineL1, and another imaginary straight line passing through the first centerC1 and the third center C3 is defined as a second straight line L2, thefirst straight line L1 and the second straight line L2 may substantiallyform a second angle (e.g., θ2=60 degree).

Referring to FIG. 3C, the plurality of holes 332 a, 332 b, and 332 cinclude a first hole 332 a, a second hole 332 b, and a third hole 332 cthat are adjacent to each other. The first, second, and third holes 332a, 332 b, and 332 c may be spaced from each other at different spatialintervals. For example, when a center of the first hole 332 a is definedas a first center C1, a center of the second hole 332 b is defined as asecond center C2, and a center of the third hole 332 c is defined as athird center C3, the first center C1 may be spaced apart from each ofthe second center C2 and the third center C3 by different spatialintervals. In such an exemplary embodiment, the first, second, and thirdholes 332 a, 332 b, and 332 c may be spaced apart from each other bydifferent spatial intervals of about 300 nm or more. That is, the firstcenter C1 may be spaced apart from the second center C2 and the thirdcenter C3 by different spatial intervals, respectively, of about 300 nmor more.

In an exemplary embodiment, the metal wirings 321, 322, 323, 324, 325,and 326 respectively defining the plurality of holes 331 a, 331 b, 331 cor the plurality of holes 332 a, 332 b, and 332 c are connected in theform of a matrix. Accordingly, electric conductivity of the metalwirings 321, 322, 323, 324, 325, and 326 may not be reduced, and themechanical durability of the metal wirings is improved. Accordingly,detachment of the metal wirings 321, 322, 323, 324, 325, and 326 fromthe flexible substrate 110 may be substantially prevented.

FIG. 4 is a flowchart illustrating a process of manufacturing a flexibledisplay device according to a first exemplary embodiment. FIGS. 5A, 5B,5C, and 5D are views illustrating a process of manufacturing theflexible display device according to the first exemplary embodiment.FIG. 6A is a plan view illustrating a part A of FIG. 5D, and FIG. 6B isa plan view illustrating a part B of FIG. 5D.

Hereinafter, a process of manufacturing a flexible display deviceaccording to the first exemplary embodiment will be described in detailwith reference to FIGS. 4, 5A, 5B, 5C, 5D, 6A, and 6B.

First, as illustrated in FIGS. 4 and 5A, a metal thin film 320′ isdeposited on a mold substrate 500 defined with a plurality of grooves510 (S01).

The mold substrate 500 may include a polymer having elasticity. Forexample, the mold substrate 500 may include polydimethylsiloxane (PDMS),polyurethane acrylate (PUA), or the like.

The metal thin film 320′ may be deposited on the mold substrate 500 byone of a sputtering method, an E-beam evaporation method, a thermalevaporation method, a laser molecular beam epitaxy (L-MBE) method, and apulsed and laser deposition (PLD) method.

When the metal thin film 320′ is deposited on the mold substrate 500, asthe linearity of a metal material forming the metal thin film 320′increases, the metal thin film 320′ may be substantially prevented frombeing deposited on a side surface of the plurality of grooves 510 of themold substrate 500, such that the plurality of holes 331 a, 331 b, and331 c of the metal wiring 320 to be described below may be moreaccurately defined.

Subsequently, as illustrated in FIG. 5B, the photo-curable adhesivelayer 310 is formed on the flexible substrate 110 (S02). For example,the photo-curable adhesive layer 310 may be formed by a spin coatingmethod and may be formed on the flexible substrate 110 to have a uniformthickness.

Although not illustrated, pre-curing of the photo-curable adhesive layer310 on the flexible substrate 110 may be further performed. For example,to transfer the metal thin film 320′ to the photo-curable adhesive layer310 in a step to be described below, adhesiveness of the photo-curableadhesive layer 310 may be maintained by controlling a pre-curing time.

Next, the metal thin film 320′ is transferred onto the photo-curableadhesive layer 310 to form the metal wiring 320 that defines theplurality of holes 331 a, 331 b, and 331 c (S03). For example, the metalthin film 320′ is brought into contact with the photo-curable adhesivelayer 310, and a pressing force is applied to the mold substrate 500 andthe flexible substrate 110 to transfer the metal thin film 320′ disposedon the mold substrate 500 to the photo-curable adhesive layer 310. Insuch an exemplary embodiment, the pressing force applied to the moldsubstrate 500 and the flexible substrate 110 may be controlled so thatthe metal thin film 320′ deposited inside the plurality of grooves 510is not transferred to the photo-curable adhesive layer 310.

Finally, the photo-curable adhesive layer 310 is completely cured (S04).Accordingly, the metal thin film 320′ is completely transferred to thephoto-curable adhesive layer 310.

The mold substrate 500 and the flexible substrate 110 are detached fromeach other, and the metal wiring 320 formed of the metal thin film 320′is separated from the mold substrate 500, as illustrated in FIG. 5D.

The metal thin film 320′ except for a portion deposited inside theplurality of grooves 510 is transferred to the photo-curable adhesivelayer 310. That is, the portion of the metal thin film 320′ located onthe photo-curable adhesive layer 310 corresponding to the plurality ofgrooves 510 of the mold substrate 500 is not transferred. Accordingly,the plurality of holes 331 a, 331 b, and 331 c are defined at positionscorresponding to the plurality of grooves 510 by the metal wiring 320that is formed of the metal thin film 320′.

As illustrated in FIG. 6A, the plurality of holes 331 a, 331 b, and 331c may include a first hole 331 a, a second hole 331 b, and a third hole331 c that are adjacent to each other. The first, second, and thirdholes 331 a, 331 b, and 331 c may be spaced apart from each other atsubstantially equal spatial intervals. For example, when a center of thefirst hole 331 a is defined as a first center C1, a center of the secondhole 331 b is defined as a second center C2, and a center of the thirdhole 331 c is defined as a third center C3, the first center C1 may bespaced equally from the second center C2 and the third center C3(W1=W2). In such an exemplary embodiment, the first center C1 may bespaced apart from each of the second center C2 and the third center C3by a spatial interval of about 300 nm or more and about 700 nm or less.In addition, when an imaginary straight line passing through the firstcenter C1 and the second center C2 is defined as a first straight lineL1, and another imaginary straight line passing through the first centerC1 and the third center C3 is defined as a second straight line L2, thefirst straight line L1 and the second straight line L2 may substantiallyform a first angle (e.g., θ1=90 degree). However, exemplary embodimentsare not limited thereto, and as in the second exemplary embodiment, thefirst straight line L1 and the second straight line L2 may substantiallyform a second angle θ2 that is different from the first angle θ1 (θ2=60degree).

Each of the plurality of holes 331 a, 331 b, and 331 c may have adiameter R of about 200 nm or more and about 500 nm or less on a plane.Accordingly, each of the plurality of holes 331 a, 331 b, and 331 c mayhave an area in a range from about 0.1 μm² to about 0.2 μm² on theplane.

The plurality of grooves 510 of the mold substrate 500 may include afirst groove 511, a second groove 512, and a third groove 513 that areadjacent to each other. The first, second, and third grooves 511, 512and 513 may be spaced from each other at substantially equal spatialintervals. For example, when a center of the first groove 511 is definedas a fourth center C4, a center of the second groove 512 is defined as afifth center C5, and a center of the third groove 513 is defined as asixth groove C6, the fourth center C4 may be spaced equally from thefifth center C5 and the sixth center C6 (W1′=W2′). In such an exemplaryembodiment, the first center C1 may be spaced apart from each of thesecond center C2 and the third center C3 by a spatial interval of about300 nm or more and about 700 nm or less. In addition, when an imaginarystraight line passing through the fourth center C4 and the fifth centerC5 is defined as a third straight line L3, and another imaginarystraight line passing through the fourth center C4 and the sixth centerC6 is defined as a fourth straight line L4, the third straight line L3and the fourth straight line L4 may substantially form a first angle(θ1′=90 degree). However, exemplary embodiments are not limited thereto,and as in the second exemplary embodiment, the third straight line L3and the fourth straight line L4 may substantially form a second angleθ2′ that is different from the first angle θ1′ (e.g., θ2′=60 degree).

Each of the plurality of grooves 511, 512, and 513 may have a diameterR′ of about 200 nm or more and about 500 nm or less on a plane.Accordingly, each of the plurality of grooves 511, 512, and 513 may havean area in a range from about 0.1 μm² to about 0.2 μm² on a plane.

According to the first exemplary embodiment, while the metal thin film320′ is transferred to the photo-curable adhesive layer 310, theplurality of holes 331 a, 331 b, and 331 c overlap the plurality ofgrooves 511, 512, and 513. For example, as illustrated in FIGS. 6A and6B, the first, second, and third centers C1, C2, and C3 substantiallyoverlap the fourth, fifth, and sixth centers C4, C5, and C6,respectively, and the first and second straight lines L1 and L2substantially overlap the third and fourth straight lines L3 and L4,respectively.

The plurality of holes 331 a, 331 b, and 331 c have substantially equalsizes and substantially identical shapes as those of the plurality ofgrooves 511, 512, and 513, respectively. For example, each of theplurality of holes 331 a, 331 b, and 331 c and the plurality of grooves511, 512, and 513 may have a circular shape having the substantiallyequal diameter R. However, exemplary embodiments are not limitedthereto, and each of the plurality of holes 331 a, 331 b, and 331 c andthe plurality of grooves 511, 512, and 513 may have a polygonal shapehaving a substantially equal diagonal line.

The first angle θ1 between the first straight line L1 and the secondstraight line L2 may be substantially equal to the first angle θ1′between the third straight line L3 and the fourth straight line L4.

FIGS. 7A and 7B are views illustrating mechanical characteristics of ametal wiring according to an exemplary embodiment.

A relative change in the mechanical durability and electric conductivityof the metal wiring according to an exemplary embodiment will bedescribed in detail with reference to FIGS. 7A and 7B.

FIG. 7A is a graph showing a relative change in electric conductivity ofa silver (Ag) film as represented by ΔR/R₀ (here R₀ represents abaseline resistance when the bending radius is 20 mm, and ΔR representsa change of the resistance compared to the baseline resistance R₀ as thebending radius changes) depending on a bending radius of a flexiblesubstrate. In the case of a conventional Ag film not defined with holes,it may be appreciated that the relative change of electric conductivityincreases as the bending radius decreases. On the other hand, in thecase of Ag films according to the first exemplary embodiment having theAg film with a square hole pattern and the second exemplary embodimenthaving the Ag film with a hexagonal hole pattern, it may be appreciatedthat the relative change of electric conductivity is relatively lessthan that of the conventional Ag film with no holes. In particular, itmay be appreciated that the relative change of electric conductivity ofthe Ag film according to the second exemplary embodiment with ahexagonal hole pattern is smaller than that according to the firstexemplary embodiment with a square hole pattern.

FIG. 7B is a graph showing a relative change ΔR/R₀ of electricconductivity of an Ag film depending on a bending cycle of a flexiblesubstrate. In the case of a conventional Ag film not defined with holes,it may be appreciated that the relative change ΔR/R₀ of electricconductivity increases as the bending cycle increases. On the otherhand, it may be appreciated that, in the case of the Ag films accordingto the first exemplary embodiment and the second exemplary embodiment,as compared to the conventional Ag film, the relative change ΔR/R₀ ofelectric conductivity depending on bending cycle is relatively small,and the relative change ΔR/R₀ of electric conductivity does not greatlyincreases although the bending cycle increases. In particular, in thecase of the Ag film according to the second exemplary embodiment with ahexagonal hole pattern, it may be appreciated that the relative changeΔR/R₀ of electric conductivity depending on bending cycle is smallerthan the first exemplary embodiment with a square hole pattern, andsubstantially no relative change ΔR/R₀ is observed although the bendingcycles up to 10000 cycles.

FIG. 8 is a plan view illustrating a flexible display device accordingto an exemplary embodiment, and FIG. 9 is a cross-sectional view takenalong the line I-I′ of FIG. 8.

The flexible display device is assumed to be an organic light emittingdiode (“OLED”) display device. However, the scope of exemplaryembodiments is not limited to the OLED display device. For example,exemplary embodiments may be applied to a liquid crystal display (“LCD”)device.

Referring to FIGS. 8 and 9, the flexible display device includes aflexible substrate 110, a wiring portion 130, and an OLED 210.

A buffer layer 120 is disposed on the flexible substrate 110. The bufferlayer 120 may include one or more layers selected from various inorganiclayers and organic layers. The buffer layer 120 may serve tosubstantially prevent infiltration of undesirable elements, such asimpurities and moisture, into the wiring portion 130 and the OLED 210,and to planarize a surface below the buffer layer 120. However, thebuffer layer 120 is not invariably necessary and may be omitted.

The wiring portion 130 is disposed on the buffer layer 120. The wiringportion 130 includes a switching thin film transistor (“TFT”) 10, adriving TFT 20, and a capacitor 80 that drives the OLED 210. The OLED210 emits light according to a driving signal received from the wiringportion 130 to display images.

FIGS. 8 and 9 illustrate an active matrix-type organic light emittingdiode (AMOLED) display device having a 2Tr-1Cap structure. For example,the 2Tr-1Cap structure may include two TFTs, e.g., the switching TFT 10and the driving TFT 20, and one capacitor 80 in each pixel, butexemplary embodiments are not limited thereto. For example, the OLEDdisplay device may include three or more TFTs and two or more capacitorsin each pixel and may further include additional wirings. Herein, theterm “pixel” refers to a unit for displaying an image, and the OLEDdisplay device displays images using a plurality of pixels.

Each pixel includes the switching TFT 10, the driving TFT 20, thecapacitor 80, and the OLED 210. In addition, a gate line 151 extendingalong one direction, and a data line 171 and a common power line 172insulated from and intersecting the gate line 151 are also provided inthe wiring portion 130. Each pixel may be defined by the gate line 151,the data line 171, and the common power line 172 as a boundary, butexemplary embodiments are not limited thereto. The pixels may be definedby a pixel defining layer 190.

The capacitor 80 includes a pair of capacitor plates 158 and 178, havingan insulating interlayer 145 interposed therebetween. In such anexemplary embodiment, the insulating interlayer 145 may be a dielectricelement. A capacitance of the capacitor 80 is determined by electriccharges accumulated in the capacitor 80 and a voltage across the pair ofcapacitor plates 158 and 178.

The switching TFT 10 includes a switching semiconductor layer 131, aswitching gate electrode 152, a switching source electrode 173, and aswitching drain electrode 174. The driving TFT 20 includes a drivingsemiconductor layer 132, a driving gate electrode 155, a driving sourceelectrode 176, and a driving drain electrode 177. A gate insulatinglayer 140 is further provided to insulate the semiconductor layers 131and 132 and the gate electrodes 152 and 155.

The switching TFT 10 may function as a switching element that selects apixel to perform light emission. The switching gate electrode 152 isconnected to the gate line 151, and the switching source electrode 173is connected to the data line 171. Spaced apart from the switchingsource electrode 173, the switching drain electrode 174 is connected toone of the capacitor plates of the capacitor 80, e.g., the capacitorplate 158.

The driving TFT 20 applies a driving power that allows an organic lightemitting layer 212 of an OLED 210 in a selected pixel to emit light to afirst electrode 211 that is a pixel electrode PE. The driving gateelectrode 155 is connected to said one capacitor plate 158 that isconnected to the switching drain electrode 174. Each of the drivingsource electrode 176 and the other capacitor plate of the capacitor 80,e.g., the capacitor plate 178, is connected to the common power line172. The driving drain electrode 177 is connected to the first electrode211 of the OLED 210 through a contact hole.

The switching TFT 10 is driven based on a gate voltage applied to thegate line 151 and serves to transmit a data voltage applied to the dataline 171 to the driving TFT 20. A voltage equivalent to a differencebetween a common voltage applied to the driving TFT 20 from the commonpower line 172 and the data voltage transmitted by (or from) theswitching TFT 10 is stored in the capacitor 80, and a currentcorresponding to the voltage stored in the capacitor 80 flows to theOLED 210 through the driving TFT 20 such that the OLED 210 may emitlight.

According to an exemplary embodiment, the gate line 151, the data line171, and the common power line 172 may include the photo-curableadhesive layer 310 and the metal wiring 320 described above. That is,according to an exemplary embodiment, each of the gate line 151, thedata line 171, and the common power line 172 may define a plurality ofholes, and the gate line 151, the data line 171, and the common powerline 172 may be improved in terms of mechanical durability such thatdetachment of the metal wiring 320, such as the gate line 151, the dataline 171, and the common power line 172, may be substantially prevented.

A planarization layer 146 is disposed on the insulating interlayer 145.The planarization layer 146 includes an insulating material and protectsthe wiring portion 130.

The OLED 210 is disposed on the planarization layer 146. The OLED 210includes a first electrode 211, an organic light emitting layer 212disposed on the first electrode 211, and a second electrode 312 disposedon the organic light emitting layer 212. Holes and electrons areinjected into the organic light emitting layer 212 from the firstelectrode 211 and the second electrode 312, respectively, and arecombined therein to form an exciton. When the exciton falls from anexcited state to a ground state, light emission occurs.

The first electrode 211 is an anode for injecting holes, and the secondelectrode 213 is a cathode for injecting electrons. However, exemplaryembodiments are not limited thereto, and the first electrode 211 may bea cathode, and the second electrode 213 may be an anode.

The first electrode 211 may include a reflective layer, and the secondelectrode 213 may include a semi-transmissive layer. Accordingly, alight generated in the organic light emitting layer 212 is emittedthrough the second electrode 213, and thus the structure of a topemission type may be achieved. However, exemplary embodiments are notlimited thereto.

The reflective electrode and the semi-transmissive electrode may includeone or more metals of magnesium (Mg), silver (Ag), gold (Au), calcium(Ca), lithium (Li), chromium (Cr), copper (Cu), and aluminum (Al), or analloy thereof. In such an exemplary embodiment, the reflective electrodeor the semi-transmissive electrode may be determined according to thethickness. In general, the semi-transmissive electrode may have athickness of about 200 nm or less.

For example, the first electrode 211 may include a reflective layerincluding one or more metals of magnesium (Mg), silver (Ag), gold (Au),calcium (Ca), lithium (Li), chromium (Cr), copper (Cu), and aluminum(Al) and a transparent conductive layer disposed on the reflectivelayer. In such an exemplary embodiment, the transparent conductive layermay include transparent conductive oxide (TCO). Examples of the TCO mayinclude: indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide(ZnO), aluminum zinc oxide (AZO), and/or indium oxide (In₂O₃). Sincesuch a transparent conductive layer including TCO has a high workfunction, hole injection through the first electrode 211 may becomesmooth.

In addition, the first electrode 211 may have a triple-layer structurein which a transparent conductive layer, a reflective layer, and atransparent conductive layer are sequentially stacked.

The second electrode 213 may include a semi-transmissive layer includingone or more metals selected from the group consisting of magnesium (Mg),silver (Ag), gold (Au), calcium (Ca), lithium (Li), chromium (Cr),copper (Cu), and aluminum (Al).

Although not illustrated, at least one of a hole injection layer HIL anda hole transport layer HTL may further be disposed between the firstelectrode 211 and the organic light emitting layer 212. In addition, atleast one of an electron transport layer ETL and an electron injectionlayer EIL may further be disposed between the organic light emittinglayer 212 and the second electrode 213.

The pixel defining layer 190 has an opening. The opening of the pixeldefining layer 190 exposes a portion of the first electrode 211. Thefirst electrode 211, the organic light emitting layer 212, and thesecond electrode 213 are sequentially stacked at the opening of thepixel defining layer 190. As such, the pixel defining layer 190 maydefine a light emission area.

In an exemplary embodiment, the second electrode 213 may be disposed onthe pixel defining layer 190 as well as on the organic light emittinglayer 212.

As set forth hereinabove, according to one or more exemplaryembodiments, the flexible display device may provide the followingeffects.

Metal wirings of a metal thin film disposed on a flexible substrate areconnected in the form of a matrix such that detachment of metal wiringsmay be substantially prevented while electric conductivity is notreduced.

While the present disclosure has been illustrated and described withreference to the exemplary embodiments thereof, it will be apparent tothose of ordinary skill in the art that various changes in form, anddetail may be formed thereto without departing from the spirit, andscope of the present disclosure.

What is claimed is:
 1. A method of manufacturing a flexible displaydevice, the method comprising: depositing a metal thin film on a moldsubstrate defined with a plurality of grooves; forming a photo-curableadhesive layer on a flexible substrate; transferring the metal thin filmon the photo-curable adhesive layer to form a metal wiring that definesa plurality of holes corresponding to the plurality of grooves; andcuring the photo-curable adhesive layer.
 2. The method of claim 1,wherein each of the plurality of grooves and the plurality of holes hasan area in a range from about 0.1 μm² to about 0.2 μm² on a plane. 3.The method of claim 1, wherein each of the plurality of grooves and theplurality of holes has at least one of a circular shape and a polygonalshape on a plane.
 4. The method of claim 1, wherein the plurality ofholes comprises a first hole, a second hole, and a third hole that areadjacent to each other, and a first imaginary straight line passingthrough a center of the first hole and a center of the second hole and asecond imaginary straight line passing through the center of the firsthole and a center of the third hole substantially form a right angle. 5.The method of claim 1, wherein the plurality of holes comprises a firsthole, a second hole, and a third hole that are adjacent to each other,and a first imaginary straight line passing through a center of thefirst hole and a center of the second hole and a second imaginarystraight line passing through the center of the first hole and a centerof the third hole substantially form 60 degrees.
 6. The method of claim1, wherein the grooves and the holes are spaced apart from each other ata substantially equal spatial interval.
 7. The method of claim 1,wherein the grooves and the holes are spaced apart from each other by aspatial interval of about 300 nm or more.
 8. The method of claim 1,wherein the metal wiring is in the form of a matrix.
 9. The method ofclaim 1, further comprising pre-curing the photo-curable adhesive layerbefore transferring the metal thin film on the photo-curable adhesivelayer to form the metal wiring that defines the plurality of holes. 10.The method of claim 1, wherein the metal wiring comprises at least oneof Al, Ag, Cu, Au, Pt, Fe, Ni, and/or Ti.